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This is an introductory course to microelectronics which is the technological base for IT industry. Students will gain knowledge of the scope, theoretical basis, design hierarchy, practical application and market structure of integrated circuit (IC). Latest developments such as IC design for Apple products and artificial intelligence will be introduced for students’ better understanding of the importance of IC. In laboratory sessions students will be provided with the opportunity to observe and practice so that they can have a vivid impression of IC design and fabrication.
This text is written for college students in two-year and four-year technology programs with a basic understanding of high school chemistry, physics, and math. It also serves to be a practical reference as well as a standard text in corporate and technical training classes. There are twenty chapters altogether. Chapters One to Thirteen presents fundamental technical information relevant to semiconductor manufacturing. Chapter Fourteen presents a process model overview with a general flowchart that links the major areas in a wafer fab. Chapters Fifteen to Nineteen cover each of the major processes in the fab. Chapter Twenty provides an overview of the back-end process for IC assembly and packaging.
This book is aimed at bringing together quantum mechanics, the quantum theory of solids, semiconductor material physics, and semiconductor device physics. Part One introduces the crystal structure of solids leading to the ideal single-crystal semiconductor material, quantum mechanics and the quantum theory of solids, the physics of the semiconductor in thermal equilibrium, the transport phenomena of the charge carriers in a semiconductor, and the nonequilibrium excess carrier characteristics. Part Two covers the electrostatics of the basic pn junction, the current-voltage, metal-semiconductor junctions and semiconductor heterojunctions, the basic physics of the metal-oxide-semiconductor field-effect transistor, the theory of the bipolar transistor, and the junction field-effect transistor. Part Three considers optical devices, semiconductor microwave devices and semiconductor power devices.
This book is an introduction to the physical principles of modern semiconductor devices and their advanced fabrication technology. The target audience of the book are undergraduate students in applied physics, electrical and electronics engineering, and material science, as well as graduate students, practicing engineers, and scientists who needs to replenish knowledge on this subject. The text is divided into three parts. Beyond the three parts, the book begins with a Chapter 0 that presents a historical review of major semiconductor devices. Part One describes the basic properties of semiconductors and their conduction processes. Part Two discusses the physics and characteristics of all major semiconductor devices. Part Three considers processing technology from crystal growth to impurity doping.
The first part covers Chapters 1 to 6 and focuses on the topics of hierarchical IC design, standard CMOS logic design, introductory physics of metal-oxide-semiconductor (MOS) transistors, device fabrication, physical layout, circuit simulation, and power dissipation and low-power design principles and techniques. The second part comprises Chapters 7 to 9 and deals with static logic and dynamic logic, as well as sequential logic. The third part covers Chapters 10 to 16 and an appendix and mainly looks at the datapath subsystem designs, memory modules, design methodologies, and implementation option, interconnect, power distribution and clock designs, input/output modules, and ESD protection networks, as well as testing and testable designs.
This book takes a unique and modern approach to digital design. Beginning with digital logic gates and progressing to the design of combinational and sequential circuits, the book continues to introduces the design of an actual MIPS processor. SystemVerilog and VHDL are integrated throughout the text in examples illustrating the methods and techniques for CAD-based circuit design. This second edition offers a number of special features, including side-by-side coverage of SystemVerilog and VHDL, classic MIPS Architecture and Microarchitechture, real-world perspectives, accessible overview of advanced microarchitecture, end-of-chapter exercises and interview questions.
This book deals with the analysis and design of analog CMOS integrated circuits, emphasizing fundamentals as well as new paradigms that are essential for modern analog circuits. It describes basic physics and operation of MOS devices; deals with single-stage and differential amplifiers and current mirrors; introduces two imperfections of circuits-frequency response and noise; describes feedback, operational amplifiers, and stability in feedback systems; deals with bandgap references, elementary switched-capacitor circuits, and the effect of nonlinearity and mismatch; presents high-order MOS device effects and models; describes CMOS fabrication technology with a brief overview of layout design rules; and presents the layout and packaging of analog and mixed-signal circuits.
This book serves the training needs of wafer-fabrication workers, whether they be production workers, technicians, professionals in the materials and equipment sectors, or engineers. There are eighteen chapters in this book, covering every stage of semiconductor processing, including the semiconductor industry, properties of semiconductor materials and chemicals, crystal growth and silicon wafer preparation, overview of wafer fabrication and packaging, contamination control, productivity and process yields, oxidation, the ten-step patterning process-surface preparation to exposure, the ten-step patterning process-developing to final inspection, next generation lithography, doping, layer deposition, metallization, process and device evaluation, the business of wafer fabrication, devices and integrated circuit formation, integrated circuits, and packaging.
